Radiation Hardened Integrated Circuit Fabrication Process Design Kit for Advanced Cryogenic Imagers
Award amount
$1,249,926Program and phase
SBIR · Phase II – Direct to Phase IIAward year
2023Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- APOGEE SEMICONDUCTOR, INC.
- Proposal award date
- 2023-02-10
- Contract end date
- 2024-11-11
- UEI
- SQ3NLYSGDAW7
- Solicitation number
- X23.4
- Topic code
- AFX234-DCSO2
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- SBIR Phase II: Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
- STTR Phase I:Low-Cost Packaging Solution for Space-Grade and High-Reliability Integrated Circuits
- A Modular, High-Efficiency, Radiation-Hardened, DC-DC Converter with Decentralized Control
- A Modular, High-Efficiency, Radiation-Hardened, DC-DC Converter with Decentralized Control
- Cryogenic Radiation-Hard Read-out Integrated Circuit Electronics Process Design Kit
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- AeroISU: Real-time Visibility and Mission Readiness of Industrial Storage Units (ISU), Containers & other USAF Equipment
- Trans Astronautica’s Sutter Turn Key Observatory
- Quantum Secure Identification
- Low-Probability-of-Intercept Terahertz Communications for Air Force Applications
- Accrete Argonaut Sequential
Research funding history
12 SBIR/STTR records share this UEI (2014–2024). Reported award amounts total $6,475,305. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration, Department of Energy