Smart Node based Modular Avionics Interface for Ballistic Missile systems

We propose a high-performance smart node as remote analog to digital translator (ADT) for modular avionics control for ballistic missile systems. Our system is a low cost, versatile, and mass-production capable solution for hardening of electronics simultaneously against both high ionizing radiation and high thermal exposure. By combining a proprietary buried guard ring technology (named ARCGUARD) with silicon or silicon carbide (SiC) based microelectronics, we propose a unique solution that would extend the current state-of-the-art by hardening electronics exceeding 1 Mrad of Total Ionizing Dose (TID) and operating over a temperature range of -55oC to 250oC. Our remote ADT technologies that can be applied to Ballistic Missile systems to enable legacy analog systems to interface with modern and modular avionics, while minimizing structural impacts to the existing missile. The proposed modular avionics is intended to make the entire system more flexible, secure, upgradable, lightweight, and lower cost. Our smart node based remote ADT is designed to interface a variety of sensors for temperature, pressure, torque, and frequency including resistance temperature detector (RTD), thermocouple, strain gauge, and linear variable differential transformer (LVDT) and actuators.