Advanced Low Volume Semiconductor Manufacturing

Scope The Scope of the project exclusively pertains upon building a starting point to reconstitute a successful low volume lithography system which provides significant potential to produce cost effective and rapid prototyping of advanced microelectronics. The scope of the project is limited to the tool evaluation by producing imaging data of various shapes and patterns.  Assess and Install Machine FLX1200 is a functional technology developed by Mapper (now ASML) that has been demonstrated and has been used for production at LETI (Grenoble, France). The technology was domesticated to the U.S. and is now located at North Grumman's Advanced Technology Lab in Linthicum, MD. A functionality assessment will be performed for each individual module. The FLX1200 system is made up of discrete modules, including: Vacuum system; Electron Optics; Stages; Alignment system; Wafer handling system; Data path; Data storage system; and Machine interface. The Discrete Module Assessment Task involves SecureFoundry personnel reconstructing the FLX system. During reconstruction engineers will assess functionality and evaluate for possible modifications or improvements to move towards a 22nm goal. Additionally, consumable parts (blanker devices) will be identified and reconstituted to a U.S. facility. The assessment will include: Functional evaluation Specifications vs requirements investigations Risk analysis Operational policies, constraints Support concept, availability Justification for use, change or modification in MEBDW Proof of Concept The basis of the SBIR will be to provide imaging data from at least ten wafer runs. The objective is to provide a proof of concept that the basic lithogrpahy process is scientifically sound and a larger program with additional investment from CHIPs Act is justified.