Digital Pixel Sensor with Efficient On-Chip Data Compression
Award amount
$999,995Program and phase
SBIR · Phase IIAward year
2017Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- SENSEEKER CORP
- Proposal award date
- 2017-07-17
- Contract end date
- 2020-07-16
- UEI
- EKC3M5MM9LU5
- Solicitation number
- 16.1
- Topic code
- A16-040
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Optimized Multi-Spectral Digital Pixel Readout IC
- Enhanced Uncooled SWaP-Optimized DROIC
- Evolution of 3GEN+ Advanced Process IP
- Optimized Multi-Spectral Digital Pixel Readout IC
- Advanced Digital Readout for Starting Focal Plane Arrays
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Digital Readout Integrated Circuits With Efficient, Low Power On-chip Data Compression Development
- Digital Readout Integrated Circuits With Efficient, Low Power On-chip Data Compression Development
- Digital Readout Integrated Circuits With Efficient, Low Power On-chip Data Compression
- Digital Readout Integrated Circuits With Efficient, Low Power On-chip Data Compression Development
Research funding history
17 SBIR/STTR records share this UEI (2012–2025). Reported award amounts total $8,069,516. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration