Ultra-compact, Color Visible and Shortwave Infrared (SWIR) Dual-band Camera

Ultra-compact, low light visible (VIS, 0.4-0.7 µm) and shortwave infrared (SWIR, 0.9 ñ 1.7 µm) dual-band camerasÝare of great importance in applications in both defense and civilian sectors, including target detection and discrimination, remote sensing, chemical and biological sensing and imaging, atmospheric and environmental monitoring, IR spectroscopy, material analysis, etc. However, existing VIS/SWIR dual-band camera technologies are bulky and heavy due to the complex designs of the dual-band optical imaging system, leading to significant increases in size, weight, and power (SWaP). Additionally, the heterogeneous integration of different materials is required to achieve effective dual-band photodetection and imaging, which significantly adds to the system's complexity and cost.ÝÝThis SBIR project aims toÝdevelop a new ultra-compact, color VIS/SWIR dual-band camera with significantly reduced SWaP for low light sensing and imaging. For the Phase I project, we will design a 2x2 color VIS/SWIR dual-bandÝsensor arrayÝand develop the fabrication processes. In Phase I option, we will fabricate a preliminary device and test it for a proof-of-concept demonstration of the VIS/SWIR dual-band photodetection and CMOS process compatibility. In Phase II, a prototype of a large format (1920◊1080) colorÝVIS/SWIR dual-bandÝcamera will be developed and characterized.ÝCommercialization of the CMOS-compatibleÝVIS/SWIR dual-band cameras will be carried out, including identifying civilian and defense applications and customers, investigating market needs and determining device specifications, as well as offering engineering samples and collaborating with prime vendors for large volume production.